| 摘要 |
PROBLEM TO BE SOLVED: To provide a camera module component which has enough heat resistance to a high-temperature reflow soldering process and less dimensional anisotropy and which achieves the suppression of occurrence of dust by sliding motion.SOLUTION: A camera module component includes polyamide (A) containing a unit which includes a dicarboxylic acid (a) containing at least 50 mol% of an alicyclic dicarboxylic acid and diamine (b) containing at least 50 mol% of diamine with a substituent branching off from a main chain. |
