| 摘要 |
This invention relates to a carrier for transporting integrated circuit devices. In particular, the carrier is configured to cradle devices which have preformed leads which usually extend around the perimeter of the device and tend to be fairly fragile. The carrier is made up of a carrier top and a carrier bottom, which are securely closed through the attachment of several spring clamps. The bottom provides a secure nest which is configured to the shape of the body of the device. The top includes a hold-down member which houses two rings, a compression ring and a contact ring, within a channel. The compression ring is made of a rubber like material that can elastically compress under contact pressure, while the contact ring is made of a hard material, which will not stick to the top of the device. The contact ring, which is positioned between the compression ring and the device, engages the device when the carrier top and the carrier bottom are mated. As a consequence of its abutting relationship with the compression ring and the resilient qualities of the compression ring, the contact ring will have a tendency to urge the device to remain securely seated in the nest. Thus, the device, including its fragile preformed leads, will remain undamaged even though the carrier may be subject to various physical forces that are common in a robust transportation environment.
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