发明名称 Integrated circuit and a method to optimize strain inducing composites
摘要 A method to design an IC is disclosed to provide a uniform deposition of strain-inducing composites is disclosed. The method to design the IC comprises, determining a total strain-inducing deposition area on an IC design. Then, the total strain inducing deposition area is compared with a predefined size. A dummy diffusion area is modified to increase the total strain-inducing deposition area, when the total strain-inducing deposition area is below the predefined size. Finally, the strain-inducing deposition area is optimized. A method to manufacture the IC and the IC is also disclosed.
申请公布号 US9484411(B1) 申请公布日期 2016.11.01
申请号 US201414306979 申请日期 2014.06.17
申请人 Altera Corporation 发明人 Venkitachalam Girish;Hsu Che Ta;Richter Fangyun;McElheny Peter J.
分类号 H01L29/16;H01L29/10;H01L29/165;H01L29/267 主分类号 H01L29/16
代理机构 Okamoto & Benedicto LLP 代理人 Okamoto & Benedicto LLP
主权项 1. An integrated circuit (IC), comprising: a substrate, wherein the substrate includes functional devices formed therein; a dummy diffusion region formed within the substrate, wherein the dummy diffusion region is one of a p-type or a n-type; a strain-inducing composite embedded into the dummy diffusion region; and a strain-inducing composite disposed on top of the dummy diffusion region, wherein a crystal orientation of the strain inducing composite embedded into the dummy diffusion region is substantially identical to a crystal orientation of the strain-inducing composite disposed on to of the dummy diffusion region, and wherein the crystal orientation of the strain inducing composite embedded into the dummy diffusion region and the crystal orientation of the strain-inducing composite disposed on top of the dummy diffusion region are substantially identical to a crystal orientation of the substrate.
地址 San Jose CA US