发明名称 PROCESS FOR ELECTROPLATING
摘要 PROCESS FOR ELECTROPLATING In the electroplating of certain metals, such as zinc, a metal build-up in the electroplating bath occurs due to a higher anode efficiency than cathode efficiency, in the cell, and also due to chemical dissolution of the anode in the electroplating bath. An electrowinning cell is provided to remove metal from the electroplating bath. The electrowinning cell is operated with a current sufficient to remove metal from the bath substantially equal to that chemically dissolved into the bath as well as the build-up due to the difference in the anodic and cathodic efficiencies.
申请公布号 CA2070458(A1) 申请公布日期 1993.02.20
申请号 CA19922070458 申请日期 1992.06.04
申请人 ELTECH SYSTEMS CORPORATION 发明人 GESTAUT, LAWRENCE J.;BRANNAN, JAMES R.;VACCARO, ANTHONY J.;GROSZEK, DONALD J.
分类号 C25D21/18;(IPC1-7):C25D21/12;C25D3/22 主分类号 C25D21/18
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