发明名称 |
ELECTRICALLY CONDUCTIVE COMPOSITIONS AND METHODS FOR THE PREPARATION AND USE THEREOF |
摘要 |
Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder. |
申请公布号 |
AU2767892(A) |
申请公布日期 |
1993.05.03 |
申请号 |
AU19920027678 |
申请日期 |
1992.10.01 |
申请人 |
TORANAGA TECHNOLOGIES, INC. |
发明人 |
MIGUEL ALBERT CAPOTE;MICHAEL GEORGE TODD;NICHOLAS JOHN MANESIS;HUGH P CRAIG |
分类号 |
B23K35/22;B23K35/02;B23K35/36;B23K35/363;C08K3/02;C08K3/08;C08K5/00;C08L101/00;H01B1/00;H01B1/22;H01L23/498;H01L23/538;H05K1/09;H05K1/18;H05K3/32;H05K3/34;H05K3/40;H05K3/46 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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