| 摘要 |
PURPOSE:To polish large-diameter wafers with high efficiency by providing a conveyor belt moving from the first polishing mechanism side to the third polishing mechanism side and a feeding device feeding wafers to the belt one by one in a silicone wafer polishing device. CONSTITUTION:The first polishing mechanism 7 has a polishing surface plate 3 and a nozzle 5 feeding an abrasive, and the material of the polishing cloth stuck to the surface plate 3 is different for the second and third polishing mechanisms 8, 9. In addition, a conveying/cleaning device 27, a feeding device 17 and a storage device 18 on both sides and robots 11a, b, c are provided. In this constitution, clean water is allowed to flow from the third polishing mechanism 9 to the first polishing mechanism 7, and wafers 1 are fed onto a conveyor belt 10 from the feeding device 17 one by one. The wafer 1 is pressed on the polishing surface plate 3 and the abrasive 4 is fed for polishing. This device can obtain large-diameter, high-quality wafers for VLSI with a high yield. |
