Fabricating pillar solder bump

摘要

A substrate bonding method is able to reliably bond substrates while avoiding a reduction in yield made worse by finer pitches. The substrate bonding method can include: forming an adhesive resin layer on a surface of a first substrate on which a pad has been formed; forming an opening on the adhesive resin layer above the pad; filling the opening with molten solder to form a pillar-shaped solder bump; and applying heat and pressure to the first substrate and a second substrate while a terminal formed on the second substrate is aligned with the solder bump.

主权项

1. A bump forming method comprising:
forming an adhesive resin layer on a surface of one or more electrode pads on a first substrate; forming a first opening on the adhesive resin layer above an electrode pad from the one or more electrode pads; forming a second opening on the adhesive resin layer not above the electrode pad; forming a pillar-shaped solder bump by filling the first opening above the electrode pad with molten solder; and forming a heat-dissipating structure solder bump by filling the second opening not above the electrode pad with molten solder.