发明名称 |
Methods and apparatus of metal gate transistors |
摘要 |
In some embodiments, a method of manufacturing a device includes providing a first device with an isolation area, an active area next to the isolation area, a metal gate above the isolation area and the active area, and a dielectric layer above the metal gate. The method also includes forming a first opening within a conductive layer of the metal gate, and a second opening within the dielectric layer. The first opening and the second opening are connected, and are of a first shape. The method further includes expanding the first opening to form a third opening of a second shape within the conductive layer of the metal gate and beneath the dielectric layer, forming a first contact part by filling the third opening, and forming a second contact part by filling the second opening, the first contact part being connected to the second contact part. |
申请公布号 |
US9508590(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201614996951 |
申请日期 |
2016.01.15 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chiang Tsung-Yu;Chen Kuang-Hsin;Tien Bor-Zen;Chang Tzong-Sheng |
分类号 |
H01L21/768;H01L29/78;H01L21/28;H01L29/49;H01L29/51;H01L21/3213;H01L29/06;H01L29/66 |
主分类号 |
H01L21/768 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A method of manufacturing a device comprising:
providing a first device with an isolation area, an active area next to the isolation area, a metal gate above the isolation area and the active area, and a dielectric layer above the metal gate; forming a first opening within a conductive layer of the metal gate, and a second opening within the dielectric layer, wherein the first opening and the second opening are connected, and are of a first shape; expanding the first opening within the conductive layer of the metal gate to form a third opening, wherein the third opening is of a second shape and beneath the dielectric layer; and forming a first contact part by filling the third opening within the conductive layer, and forming a second contact part by filling the second opening, wherein the first contact part is connected to the second contact part. |
地址 |
Hsin-Chu TW |