| 摘要 |
A method for producing a ceramic-metal composite substrate, which comprises integrally bonding together a ceramic base member, metal members of a material selected from the group consisting of copper and alloys thereof, and a constraining member to be bonded to the metal member, wherein improvement comprises: bringing the metal member into close contact with ceramic base member through a thin film layer having a thickness of from 0.1 mu m to 3 mu m and containing therein an active metal; and heating the combination of the ceramic base member, the metal member, and the constraining member in an atmosphere which is difficult to react with the active metal, to a temperature ranging from a melting point of an alloy to be formed of the metal member and the active metal to a temperature below the melting point of the metal member, while applying a pressing force to combination in the direction of its thickness, thereby realizing the integral bonding.
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