Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik
摘要
The invention relates to a process for producing an adhesive bond between layers of copper, applied by thermally spraying powdered copper (4) or copper alloys, and ceramics (6). Finely grained copper powder (4) with an average grain diameter </= 20 mu m is applied to the ceramic surface by thermal spraying.
