Plastikumhüllung einsetzendes Gehäuse für eine integrierte Schaltung.
摘要
An integrated circuit package uses an encapsulant frame (7) which prevents the encapsulant (9) used to seal the integrated circuit chip (3) from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.
申请公布号
DE68908940(T2)
申请公布日期
1994.01.05
申请号
DE1989608940T
申请日期
1989.04.13
申请人
AMERICAN TELEPHONE AND TELEGRAPH CO., NEW YORK, N.Y., US
