Photolithographic method using non-photoactive resins

摘要

A method for patterning an integrated circuit workpiece comprises depositing a layer of non-photoactive material on the wafer. A reagent is deposited onto the entire surface of the material. A pattern is then created by exposing the surface with an energy source which produces a reaction within the reagent and/or between the reagent and the resin. The unreacted reagent is then removed by either physical or chemical means. Finally, the unexposed material is removed by means of an etch.