| 摘要 |
<p>A method of fabricating self aligned static induction transistors. The method comprises fabricating an N silicon on N<-> silicon substrate having an active area. A guard ring is formed around the active area. An N<+> polysilicon layer is formed that comprises source and gate regions. An oxide layer is formed on the N<+> polysilicon layer. A second polysilicon layer is formed on the oxide layer. A second oxide layer is formed on the second polysilicon layer which is then masked by a self aligning mask. Trenches are etched into the substrate using the self aligning mask and gate regions are formed at the bottom of the trenches. A first layer of metal (gate metal) is deposited to make contact with the gate regions. A layer of photoresist is deposited and planarized, and the first layer of metal is overetched below the top surface of the trench. Plasma nitride is deposited and planarized, and a polysilicon mask is deposited over the planarized layer of plasma nitride. The polysilicon mask is etched to expose the gate metal disposed on the field. A second layer of metal is deposited to make contact with the source and gate regions. A passivation layer is formed, and interconnection pads are formed that connect the first and second layers of metal. The present method employs a single minimum geometry trench mask. The key features of the transistor are defined by the trench mask and related processing parameters. Because of the self alignment achieved by the present invention, the number of channels per unit area is higher, which results in higher transconductance. In addition, some of the parasitic capacitance is eliminated by the present invention, resulting in faster operational speed. The variable sidewall trench oxide thickness allows fabrication of static induction transistors with higher or lower breakdown voltages according to the thickness that is chosen, and for a more graded P gate junction. <IMAGE></p> |
