| 摘要 |
This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive. Next, a second portion of the plurality of surface mount technology components are attached to the second layer of the first adhesive and a plated through-hole component is attached to the second adhesive applied to the primary side of the printed wiring board. Finally, the second layer of the first adhesive and the second preselected quantity of electrically conductive adhesive applied to the primary side of the printed wiring board is reflowed, thereby adhering the second portion of the plurality of surface mount technology components and a plated through-hole component to the primary side of the printed wiring board.
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