| 摘要 |
<p>An integrated circuit chip package comprising a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes at least one elongated thermal conductive member having a head portion adapted to be in contact with the flat surface of the electronic component. The member further has an elongated body portion of a preselected length greater than the thickness of the substrate. The thermal conductive member extends through a preselected hole in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.</p> |
