LIGHT EMITTING DIODE PACKAGING STRUCTURE AND PACKAGING METHOD

摘要

A light emitting diode packaging structure comprises a base substrate (1); a metal lead (3) on the base substrate (1); a cover plate (2); and a seal frame (4) sealing the cover plate (2) and the base substrate (1) together and forming an enclosure surrounding a display area (111) of the base substrate (1). The metal lead (3) extends from the display area (111) outwardly and passes through below the seal frame (4) to outside of the enclosure. The metal lead (3) has a curved configuration in plan view of the base substrate (1) within a region where the metal lead (3) overlaps with the seal frame (4).