| 摘要 |
The low thermal conductivity ceramic of the present invention comprises a sialon (Si-Al-O-N) and at least one element selected from among La, Dy, Ce, Hf and Zr and has an average grain size of 1.5 mu m or less and a thermal conductivity of 0.01 cal/cmxsx DEG C. or less. It can be produced by raising the temperature of a molding containing a sialon and the above elements in a gas atmosphere having a pressure of 5 arm or more at a high rate to conduct firing. The present invention enables the ceramic structure to be hyperfined and the phonon scattering to be enhanced, so that it is possible to provide a low thermal conductivity ceramic having a high strength and a low thermal conductivity.
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