MULTI-CHIP ELECTRONIC PACKAGE MODULE UTILIZING AN ADHESIVE SHEET

摘要

There is provided a module (10) for supporting a plurality of semiconductor devices within an electronic package. The module (10) has a support substrate (20) and an apertured substrate (42) laminated together with a polymer adhesive (44). A plurality of semiconductor devices are disposed within apertures (38) formed in the apertured substrate (42) and bonded to the support substrate (20) by that same polymer adhesive (44).