An automatic wafer etching method and apparatus.

摘要

An automatic wafer etching apparatus including a first elevator (33) and a second elevator (34) each having a top surface whose vertical cross-section is circularly concaved having a curvature equal to that of the wafers and adapted to reciprocate vertically such that the top surface can pass through the etching drum (31), and an etching drum having a main housing consisting of a pair of vertical parallel side plates opposing each other, a horizontal shaft integral with the main housing side plates; a plurality of rollers borne between the main housing side plates in a manner such that they are freely rotatory; the rollers having annular grooves in their surfaces to receive edges of wafers in a manner such that the wafers are supported vertically at suitable intervals in a horizontal row; small-diameter gears locked at those ends of the rollers. <IMAGE>