SUBSTRATE INSPECTION METHOD, COMPUTER STORAGE MEDIUM, AND SUBSTRATE INSPECTION DEVICE

摘要

This method for inspecting a substrate that is repeatedly processed along a predetermined transfer route by processing apparatuses of a plurality of different types acquires a first substrate image by capturing an image of the surface of a substrate processed by any one processing apparatus; acquires a second substrate image by capturing an image of the surface of a substrate that is the substrate that was the image capture object of the first substrate image and that was further processed by a processing apparatus separate from the one processing apparatus after the processing by the one processing apparatus; then performs defect inspection on the basis of the first substrate image and the second substrate image; and depending on whether or not a defect detected from the second substrate image was not detected from the first substrate image, specifies whether or not the defect is caused by processing after having acquired the first substrate image and before acquiring the second substrate image.