发明名称 Improvements in or relating to thermal management system.
摘要 <p>A thermal management system using an expendable liquid which undergoes phase change to a vapor as waste heat is absorbed and also possesses a high latent heat of vaporization. The vapor is expelled, carrying with it the waste heat. A vacuum source lowers the vapor pressure to lower the vaporization temperature. In first embodiments, regulated fluid flows into a heat exchanger wherein a vacuum system lowers the pressure. Waste heat transported to the heat exchanger by a coolant loop causes the liquid to boil at a desired temperature. A flow regulator controls the rate of fluid flow from the pressurized reservoir to the heat exchanger. The refrigeration effect is produced by the liquid being converted from the liquid to the vapor phase and absorbing heat from the coolant fluid during the phase change. The vacuum system provides a system pressure that results in a suitable temperature at which vaporization occurs. The fluid flow is controlled, based upon the demand from the heat load produced. The vacuum system is controlled to maintain the vacuum level. In a second group of embodiments, the electronics are disposed on a coldwall within an enclosure. The expendable liquid is controlled by a flow regulator which feeds the liquid into the enclosure. The expendable liquid is directly heated by the electronics and vaporizes in part within the enclosure. The enclosure is evacuated by a vacuum system which exhausts the vapors produced to the atmosphere while maintaining the desired degree of vacuum within the enclosure. The primary expendable liquids are ammonia, methanol and water. &lt;IMAGE&gt;</p>
申请公布号 EP0666214(A1) 申请公布日期 1995.08.09
申请号 EP19950300720 申请日期 1995.02.06
申请人 RAYTHEON TI SYSTEMS, INC. 发明人 WEBER, RICHARD M.;PRICE, DONALD C.;SHORT, BYRON E.
分类号 H05K7/20;F25D7/00;B64D13/00;F25B19/00;(IPC1-7):B64D13/00 主分类号 H05K7/20
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