| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a prepreg, a laminate and a printed wiring board excellent in high heat resistance, low dielectric constant, high metal foil adhesiveness, high glass transition temperature, low thermal expansion, moldability and plating following property.SOLUTION: There is provided a thermosetting resin composition containing (A) a maleimide compound having an N-substituted maleimide group of 15 to 65 pts.mass, (B) an epoxy resin having at least 2 epoxy groups in a molecule of 15 to 50 pts.mass, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from maleic acid anhydride of 10 to 45 pts.mass and (D) an aminotriazine phenol novolak resin of 2 to 7 pts.mass, where total sum of the (A) to (D) components is 100 pts.mass.SELECTED DRAWING: None |
