发明名称 |
ELECTRONIC PART MOUNTING DEVICE |
摘要 |
An electronic part mounting device which comprises a laminate of a circuit board with structural members, electronic parts provided in the opening formed in the laminate and a sealing agent layer for sealing the electronic parts, an outer periphery of the opening being located inside an outer periphery of the sealing agent layer. With this arrangement, even when the device bent, the sealing agent layer engages with the circuit board or the structural member disposed within its outer periphery to prevent the electronic parts from protruding. Further, this device is simple to manufacture and so is extremely inexpensive.
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申请公布号 |
WO9526885(A1) |
申请公布日期 |
1995.10.12 |
申请号 |
WO1995JP00595 |
申请日期 |
1995.03.29 |
申请人 |
IBIDEN CO., LTD.;HORIBA, YASUHIRO;KOHMURA, TOSHIMI |
发明人 |
HORIBA, YASUHIRO;KOHMURA, TOSHIMI |
分类号 |
G06K19/077;(IPC1-7):B42D15/10;G06K19/00 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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