Wire loops, methods of forming wire loops, and related processes

摘要

A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height.

主权项

1. A method of forming a wire loop comprising the steps of:
(1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the wire bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) upon the tip of the wire bonding tool reaches a predetermined height, wherein step (1) includes: (a) bonding a free air ball to the bonding location using the wire bonding tool to form a bonded ball; (b) raising the wire bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (c) closing the wire clamp; (d) lowering the wire bonding tool to a smoothing height with the wire clamp still closed; (e) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the wire bonding tool; and (f) raising the wire bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the wire bonding tool, thereby forming the conductive bump on the bonding location.