System and method for automated positioning of a substrate in a processing chamber

摘要

An improved position control means for robotic handling systems; particularly, a system and method for determining the centerpoint of a moving object, such as a semiconductor wafer, and calibration of the object support, using an array of sensors positioned generally transverse to the arcuate path of movement of the object and its support to detect the relative positions of the object and the support to a selected destination point for the purpose of precisely positioning the object relative to the selected destination point.