| 摘要 |
<p>The present invention relates to an etching process for the purpose of removing binder phase from the surface of a hard metal consisting of hard material in a binder phase based on cobalt and/or nickel. By carrying out the etching process electrolytically in a mixture containing concentrated sulfuric acid and concentrated phosphoric acid at a volume ratio of 0.5-2 with a water content of <50% at a temperature of 25 DEG -60 DEG C. an even binder phase removal without deep penetration is achieved.</p> |
