MOLD ENCAPSULATION SEMICONDUCTOR AND LEAD FRAME

摘要

In the semiconductor device, a semiconductor element is mounted on a pad of the lead frame, each bonding pad of the semiconductor element is electrically connected to an inner end of each lead of lead frames, and the remaining portion excepting an outer end of each lead is sealed with resin. The semiconductor device comprises at least one spacer bar having a bent edge portion which is in contact with the surface of resin and is extended with the lead frame pad formed as a body in the vertical direction till at least one surface of resin so as to uniformly maintain the height of the lead frame pad. The lead frame pad is uniformly sealed with resin of regular thickness.