发明名称 Process for producing an electronic part and the electronic part produced by the process
摘要 An electronic part is produced by forming two metallic wiring films of different materials on a main substrate, where a first metallic wiring film is formed on the main substrate, a protective film is formed in desired regions on the main substrate and the first metallic wiring film, and a second metallic wiring film is formed on the first metallic wiring film. The thus produced electronic part has an insulating protective film between the first and second metallic wiring films. By the presence of the protective film the surface of the first metallic wiring film is protected from etching, corrosion or deterioration by an agent for patterning the second metallic wiring film.
申请公布号 US5507403(A) 申请公布日期 1996.04.16
申请号 US19950375708 申请日期 1995.01.20
申请人 HITACHI, LTD. 发明人 SAKEMURA, YUKIO;USUI, MITSURU;WATANABE, TETSUYA
分类号 H05K1/03;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H01B13/00;B44C1/22;C23F1/00 主分类号 H05K1/03
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