发明名称 |
Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer |
摘要 |
In an integrated circuit, an opening (e.g., via or window) is filled with an Al-based plug which has essentially a <111> orientation and comprises at most three grains. These characteristics are achieved by first depositing a texture control Ti layer having substantially a (002) basal plane orientation followed by at least three Al-based sublayers. The grain sizes and deposition conditions are controlled in such a way that during deposition of the third sublayer, the microstructure of the plug adjusts itself to produce a single grain (or at most three).
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申请公布号 |
US5523259(A) |
申请公布日期 |
1996.06.04 |
申请号 |
US19940349649 |
申请日期 |
1994.12.05 |
申请人 |
AT&T CORP. |
发明人 |
MERCHANT, SAILESH M.;NANDA, ARUN K.;ROY, PRADIP K. |
分类号 |
H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L23/532;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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