发明名称 Flexible device for encapsulating electronic components
摘要 PCT No. PCT/SE93/00107 Sec. 371 Date Oct. 7, 1994 Sec. 102(e) Date Oct. 7, 1994 PCT Filed Feb. 11, 1993 PCT Pub. No. WO94/18815 PCT Pub. Date Aug. 18, 1994.A device for flexibly encasing electronic circuitry, where an electronic circuit is enclosed in a casing which includes a laminate consisting of metal and plastic sheets such as to form a diffusion impervious and electrically conductive structure which prevents harmful substances from reaching the electronic circuit and also prevents inductive electromagnetic exchange. Electrical conductors pass through the joint region of the laminate.
申请公布号 US5527989(A) 申请公布日期 1996.06.18
申请号 US19940313317 申请日期 1994.10.07
申请人 TELEFONAKTIEBOLAGET LM ERICSSON 发明人 LEEB, KARL-ERIK
分类号 H05K5/06;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K5/06
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