发明名称 Integrating enhancement mode depleted accumulation/inversion channel devices with MOSFETs
摘要 A plurality of gate trenches is formed into an epitaxial region of a first conductivity type over a semiconductor substrate. One or more contact trenches are formed into the epitaxial region, each between two adjacent gate trenches. One or more source regions of the first conductivity type are formed in a top portion of the epitaxial region between a contact trench and a gate trench. A barrier metal is formed inside each contact trench. Each gate trench is substantially filled with a conductive material separated from trench walls by a layer of dielectric material to form a gate. A heavily doped well region of a conductivity opposite the first type is provided in the epitaxial region proximate a bottom portion of each of the contact trenches. A horizontal width of a gap between the well region and the gate trench is about 0.05 μm to 0.2 μm.
申请公布号 US9484452(B2) 申请公布日期 2016.11.01
申请号 US201414565668 申请日期 2014.12.10
申请人 ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED 发明人 Bobde Madhur;Lui Sik;Yilmaz Hamza;Kim Jongoh;Ng Daniel
分类号 H01L29/78;H01L29/66;H01L29/423;H01L29/08;H01L29/40;H01L29/36 主分类号 H01L29/78
代理机构 JDI Patent 代理人 Isenberg Joshua D.;JDI Patent
主权项 1. A device, comprising: a plurality of gate trenches formed into an epitaxial region of a first conductivity type over semiconductor substrate of the first conductivity type, each gate trench being substantially filled with a conductive material that is separated from trench walls by a layer of dielectric material to form a gate; one or more contact trenches formed into the epitaxial region, each contact trench located between two adjacent gate trenches, wherein a heavily doped well region of a second conductivity type opposite to the first conductivity type is provided proximate a bottom portion of each of the one or more contact trenches and a horizontal width of a portion of the epitaxial region of the first conductivity type between the heavily doped well region and a gate trench of the plurality of gate trenches is from about 0.05 μm to about 0.2 μm; and one or more heavily doped source regions of the first conductivity type formed in a top portion of the epitaxial region, each provided between a corresponding one of the contact trenches and a corresponding one of the gate trenches; and a barrier metal formed over a mesa in a portion of the epitaxial region in which there are no heavily doped source regions, wherein the mesa is formed between two of the contact trenches and two lightly doped regions of the second conductivity type.
地址 Sunnyvale CA US