| 发明名称 |
Circuit protection device |
| 摘要 |
A circuit protection device is provided and includes a first insulation layer, a second insulation layer, a thermal fuse, a diode, a first exterior electrode pad, a second exterior electrode pad, and a third exterior electrode pad. The second insulation layer is positioned above a top surface of the first insulation layer. The thermal fuse is packaged in the first insulation layer and having a first electrode end and a second electrode end positioned opposite to the first electrode end. The diode is packaged in the second insulation layer and having a first electrode surface and a second electrode surface positioned opposite to the first electrode surface. The first exterior electrode pad is positioned on a bottom surface of the first insulation layer and electrically connected to the first electrode surface and the first electrode end. The second exterior electrode pad is positioned on the bottom surface and electrically connected to the second electrode end, while the third exterior electrode pad is positioned on the bottom surface and electrically connected to the second electrode surface. |
| 申请公布号 |
US9484337(B2) |
申请公布日期 |
2016.11.01 |
| 申请号 |
US201514835150 |
申请日期 |
2015.08.25 |
| 申请人 |
TYCO ELECTRONICS (SHANGHAI) CO. LTD. |
发明人 |
Fang Yan;Wang Bin;Ye Jianzhe;Guo Tao;Liu Jianyong |
| 分类号 |
H01L23/52;H01L27/02;H01L23/62;H01L29/861;H01L23/525 |
主分类号 |
H01L23/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit protection device, comprising:
a first insulation layer; a second insulation layer positioned above a top surface of the first insulation layer; a thermal fuse packaged in the first insulation layer and having a first electrode end and a second electrode end positioned opposite to the first electrode end; a diode packaged in the second insulation layer and having a first electrode surface and a second electrode surface positioned opposite to the first electrode surface; a first exterior electrode pad positioned on a bottom surface of the first insulation layer and electrically connected to the first electrode surface of the diode and the first electrode end of the thermal fuse; a second exterior electrode pad positioned on the bottom surface of the first insulation layer and electrically connected to the second electrode end of the thermal fuse; and a third exterior electrode pad positioned on the bottom surface of the first insulation layer and electrically connected to the second electrode surface of the diode. |
| 地址 |
Shanghai CN |
