LASER DICING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laser dicing device and a method, in which laser dicing can be performed with high accuracy since work distance can be made constant and irradiation efficiency can be improved by preventing ablation even when laser dicing is performed on a wafer, especially a thin wafer of 50 μm or less.SOLUTION: A laser dicing device includes: laser irradiation means for irradiating laser beams; a wafer table which is formed so that the laser beams are transmittable therethrough and holds a wafer; and a transparent liquid film located in a gap between a condenser lens surface of the laser irradiation means and the wafer table. The laser irradiation means irradiates the wafer with the laser beams via the wafer table and the liquid film and forms a modified layer inside the wafer.SELECTED DRAWING: Figure 1