| 摘要 |
A fan device for dissipating heat from an electronic component includes a base having a number of upward extending fins. The fins on the side portions are higher than the middle fins. A board is secured above the shorter fins and engaged between the higher fins, and includes a number of orifices for air circulation purposes. The board includes a support engaged in an opening and coupled to the board for securing a fan. Alternatively, the board may be engaged on top of the higher fins, or, the fins may have identical height and include a depression formed in the middle portion for engagement with the fan. |
