发明名称 BREAK DEVICE AND BREAKING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a breaking method by which a substrate can be broken along a scribe line even if the substrate is thin.SOLUTION: A breaking method includes steps (a), (b), (c). In the step (a), a guide bar 2 is loaded on a substrate W along a scribe line 12a. In the step (b), an impact shock which is directed to the substrate W is given onto the guide bar 2 after the step (a). In the step (c), in the state that one region of the substrate W with the scribe line 12 as a border is projected from a bearing member 30, the one region is pressed from above and is broken after the step (b).SELECTED DRAWING: Figure 1
申请公布号 JP2016221683(A) 申请公布日期 2016.12.28
申请号 JP20150106939 申请日期 2015.05.27
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SOYAMA MASANOBU
分类号 B28D5/00;G02F1/13 主分类号 B28D5/00
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