发明名称 High-density electrical interconnect system
摘要 An electrical interconnect system (FIG. 35, for example) includes a support element (13); and an array of groups (82) of multiple electrically conductive contacts (11) arranged on the support element such that at least one contact of each group includes a front surface (83) of which at least a portion faces outwardly and away from that group along a line initially intersected by at least a portion of a side surface (84) of a contact from another one of the groups of the array. In other words, at least one contact (11) of each group (82) includes a front surface (83) of which at least a portion faces at least a portion of a side surface (84) of a contact from another one of the groups with the facing surfaces being separated from one another by air only. A group of contacts may form a receiving-type interconnect component having, for example, a zero-insertion-force component for spreading apart the group of contacts.
申请公布号 US5641309(A) 申请公布日期 1997.06.24
申请号 US19950469763 申请日期 1995.06.06
申请人 CRANE, JR., STANFORD W. 发明人 CRANE, JR., STANFORD W.
分类号 H01R4/24;H01R12/04;H01R12/16;H01R13/03;H01R13/193;H01R13/26;H01R24/00;(IPC1-7):H01R9/09 主分类号 H01R4/24
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