Vapour-condensing cooler with radiator e.g. for semiconductor devices

摘要

The device incorporates a reservoir of coolant (3) to which the objects (2) requiring cooling are attached. The radiator (5) condenses the vapour evolved through an underlying coupler (4) comprising two plates (12) welded together. The vapour circulates through passages (8) into the connecting part (13) of the coupler, from which it proceeds to the radiator elements (23). Cooling air is blown over fins (26) in a duct between the radiator and coupler. The condensate returns via a separate passage (9) to the reservoir for revaporisation.