发明名称 |
Chip-sized package having metal circuit substrate |
摘要 |
A chip-sized semiconductor package having a semiconductor chip formed with bonding pads; a circuit board provided with contact pads for electrically connecting the circuit board to external terminals, and circuit patterns for electrically connecting the circuit board to the chip; a tape bonding the circuit board to the chip; and wires electrically connecting the circuit board to the bonding pads on the chip; the package being encapsulated by a molding compound so that a part of a surface of the circuit board where the contact pads are formed is exposed.
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申请公布号 |
US5684330(A) |
申请公布日期 |
1997.11.04 |
申请号 |
US19950563402 |
申请日期 |
1995.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SANG HYUK |
分类号 |
H01L23/34;H01L23/04;H01L23/12;H01L23/13;H01L23/31;H01L23/495;H01L23/498;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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