发明名称 |
Method for cleaning a process chamber |
摘要 |
Fluorocarbon and water vapor are introduced directly into a plasma in a process chamber, not downstream from the plasma, thereby creating HF vapor to clean the process chamber. The process may also be used to remove a photoresist residue left remaining on a semiconductor wafer.
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申请公布号 |
US5693147(A) |
申请公布日期 |
1997.12.02 |
申请号 |
US19950552665 |
申请日期 |
1995.11.03 |
申请人 |
MOTOROLA, INC. |
发明人 |
WARD, STEVEN D.;AVONA, PAUL V. |
分类号 |
B08B7/00;G03F7/42;H01J37/32;(IPC1-7):B08B7/00 |
主分类号 |
B08B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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