Integrated circuit wafer protection method for vacuum processing

摘要

The method involves covering the active face of the integrated circuit wafer with a protective layer of a chemically stable isolating material before processing stages. The coating is thicker near the contact pads to provide reserves of material, with openings provided above the contacts. Ink drops are used to mark individual integrated circuits that are not functional. A preliminary coating is applied before the main coating, to provide a smooth surface for the main coating.