| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sheet that gives an insulating layer that can suppress warpage in a component mounting process even if the resin sheet is thin when applied to a printed wiring board.SOLUTION: A resin sheet has a support and an adhesion layer, the adhesion layer has a first resin composition layer provided on the support, an intermediate layer provided on the first resin composition layer, and a second resin composition layer provided on the intermediate layer. An inorganic filler content in the intermediate layer is 80 mass% or more when a total content of nonvolatile components in the intermediate layer is of 100 mass%.SELECTED DRAWING: None |
