发明名称 Flerlagsfilm og laminat til anvendelse ved fremstilling af trykte kredsløbskort
摘要 <p>A multilayer film having as one surface layer thereof a support layer containing a thermoplastic resin able to withstand temperatures up to 200 degrees C. without softening and the other surface layer an adhesive layer containing a thermoplastic resin having a melting point ranging from about 100 to 200 degrees C. Optionally, a tie layer may be employed between the support layer and the adhesive layer. The multilayer film is useful as a protective carrier sheet for a cladding metal foil used in the production of printed circuit boards. The carrier sheet provides temporary, peelable surface protection for the cladding metal foil preventing contamination and physical damage to the foil both before and during printed circuit board formation. Adhesion of the carrier sheet to the cladding metal foil, measured using a 180 degree peel test is less than 0.4 pounds/in-width and greater than 0.005 pounds/in-width, and preferably less than 0.1 pounds/in-width and greater than 0.01 pounds/in-width.</p>
申请公布号 DK0464144(T3) 申请公布日期 1998.03.16
申请号 DK19900905889T 申请日期 1990.03.22
申请人 THE DOW CHEMICAL COMPANY 发明人 IMFELD, STEPHEN, M.;SHIPLEY, RANDALL, S.
分类号 B32B15/08;H05K1/03;H05K3/00;H05K3/02;H05K3/38;(IPC1-7):B32B15/08 主分类号 B32B15/08
代理机构 代理人
主权项
地址