| 摘要 |
PROBLEM TO BE SOLVED: To reduce the coupling loss of PC coupling without causing a filler to impede the coupling by filling thermosetting type molding resin, of which the optical connector ferrule is molded, with the filler of specific particle size. SOLUTION: Particle size which is smaller than that of a normally used material is selected for the filler 3 which fills the thermosetting type resin 2 for molding the optical connector ferrule and the filler 3 of 75μm in maximum value and <=15μm in center value is used. Consequently, the filler less impedes the PC coupling to reduce the coupling loss. When the particle size is up to 30μm and <=5μm in center value, the coupling loss is reduced more. In this case, epoxy resin is normally used as the molding resin 2 and silicon oxide having a small coefficient of linear expansion in general is preferably used as the material of the filler 3 so as to stabilize the molding size.
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