SEMICONDUCTOR DEVICE FABRICATING DIE FOR RESIN-SEALING SEMICONDUCTOR AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,申请号JP19960290096-传众专利搜索

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发明名称	SEMICONDUCTOR DEVICE FABRICATING DIE FOR RESIN-SEALING SEMICONDUCTOR AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH10135256(A)	申请公布日期	1998.05.22
申请号	JP19960290096	申请日期	1996.10.31
申请人	SONY CORP	发明人	MOGAMI KEIICHI
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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