Apparatus for cooling of chips using blind holes with customized depth
摘要
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.
申请公布号
US5757620(A)
申请公布日期
1998.05.26
申请号
US19960690884
申请日期
1996.08.02
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
EDWARDS, DAVID LINN;COURTNEY, MARK GERARD;FAHEY, ALBERT JOSEPH;HOPPER, GREGORY SCOTT;IRUVANTI, SUSHUMNA;JONES, CHARLES FREDERICK;MESSINA, GAETANO PAOLO;SHERIF, RAED A.