发明名称 Method and device for coating printed-circuit boards
摘要 PCT No. PCT/EP95/02309 Sec. 371 Date Dec. 23, 1996 Sec. 102(e) Date Dec. 23, 1996 PCT Filed Jun. 14, 1995 PCT Pub. No. WO96/00492 PCT Pub. Date Jan. 4, 1996The method of forming a multilayer printed circuit board includes applying a photopolymerizable coating append having a solid content of 70 to 95% by weight and a viscosity of 10 to 60 Pa.s of 25 DEG C. to a surface of the applicator cooled to a temperature of 5 DEG C. by a metering roll surface of which is controllably maintained at a temperature range from 25 DEG to 60 DEG C., so that the coating agent is deposited on opposite sides of a board and has an application viscosity of 20 to 100 Pa.s at a coating speed of 5 to 20 m/min to form a film thickening of 10 to 200 mu m.
申请公布号 US5804256(A) 申请公布日期 1998.09.08
申请号 US19960765076 申请日期 1996.12.23
申请人 SCHAEFER, HANS-JORGEN 发明人 SCHAEFER, HANS-JORGEN
分类号 B05C1/00;B05C1/08;G03F7/16;H01L21/48;H05K3/00;H05K3/10;H05K3/18;H05K3/22;H05K3/46;(IPC1-7):B05D3/06 主分类号 B05C1/00
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