发明名称 POLYESTER AMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having extremely excellent thermal stability, heat-resistance and mechanical, properties by including a polyester amide resin having a specific structure and a filler. SOLUTION: This resin composition contains (A) 100 pts.wt. of a polyester resin composed of the recurring unit of the formula I (R<1> to R<2> are each a substituted or non-substituted bivalent aliphatic group, alicyclic group or aromatic group) and (B) 1-200 pts.wt. of a filler. The component A is preferably a polyester amide resin expressed by the formula II ((m) is 6; (n) is 2), having a number-average molecular weight of >=20,000 in terms of polymethyl methacrylate and determined by gel-permeation chromatography and losing 5% of the weight at >=390 deg.C. The component B is preferably chopped strand glass fiber having a fiber diameter of 3-20μm and a fiber length of 3μm to 10 mm. The objective composition is preferably further compounded with an elastomer having a glass transition temperature of <=20 deg.C to further improve the impact resistance.
申请公布号 JPH10287807(A) 申请公布日期 1998.10.27
申请号 JP19970109134 申请日期 1997.04.25
申请人 TORAY IND INC 发明人 YAMAUCHI KOJI;SHIKAMATA AKINORI;INOUE SHUNEI
分类号 C08K3/00;C08K3/22;C08K3/26;C08K3/34;C08K3/36;C08K5/00;C08K5/098;C08K5/15;C08K5/1515;C08K5/42;C08L21/00;C08L23/16;C08L77/12;C08L101/00;(IPC1-7):C08L77/12 主分类号 C08K3/00
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