INTERELECTRODE CONNECTING STRUCTURE, INTERELECTRODE CONNECTING METHOD, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING METHOD, LIQUID CRYSTAL DEVICE, AND ELECTRONIC EQUIPMENT

摘要

Electrodes arranged at a fine pitch are accurately electrically connected to each other. When an IC chip (36) as a semiconductor device is joined to an external substrate (32a), a conductive paste (41) is sprayed in minute dots onto terminals (37) on the substrate (32a), and the chip (36) is stuck to the substrate (32a) in a state where the pads (38) of the chip (36) are aligned with the paste (41). Since the paste (41) is printed on the electrodes (37) by spraying, the paste (41) can be accurately put on the electrodes (37) even when the electrodes (37) are arranged at a fine pitch. In addition, since the electrodes (37) are electrically connected to the pads (38) through the paste (41), a stable conducting state is obtained. This electrical connecting method can be suitably applied to the connection between a substrate-side electrode formed on a substrate and an element-side electrode formed on an electronic element mounted on the substrate in a wide range of devices, such as liquid crystal device, electronic equipment, etc.