The base plate for an electronic component is provided by an insulating substrate (5), provided with a printed circuit (3) and a fixing region (51) for the electronic component, to which a heat sink block (1) is secured. The heat sink block has a flat main body (15), a perpendicular region (13) projecting in the direction of the base plate and a deformation region (11) for absorbing the deformation of the insulating substrate.
