| 发明名称 |
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A chip package includes a chip having an upper surface and a lower surface. A sensing element is disposed on the upper surface of the chip, and a thermal dissipation layer is disposed below the lower surface of the chip. A plurality of thermal dissipation external connections are disposed below the thermal dissipation layer and in contact with the thermal dissipation layer. |
| 申请公布号 |
US2016355393(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615171971 |
申请日期 |
2016.06.02 |
| 申请人 |
XINTEC INC. |
发明人 |
LIU Tsang-Yu;SUEN Wei-Luen;LEE Po-Han |
| 分类号 |
B81B3/00;B81C1/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a chip having an upper surface and a lower surface; a sensing element disposed at the upper surface; a thermal dissipation layer disposed at the lower surface; and a plurality of thermal dissipation external connections disposed underneath and in contact with the thermal dissipation layer. |
| 地址 |
Taoyuan City TW |
